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Congressional Daily Record
This section is about changes proposed to a bill or resolution. It mentions members such as Charles Ellis Schumer.
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June 24, 2026
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Download official Senate Record PDFReturn to issue contextSA 6345. Mr. SCHUMER (for himself and Mr. Cotton) submitted an amendment intended to be proposed by him to the bill S. 4784, to authorize appropriations for fiscal year 2027 for military activities of the Department of Defense, for military construction, and for defense activities of the Department of Energy, to prescribe military personnel strengths for such fiscal year, and for other purposes; which was ordered to lie on the table; as follows:
At the end of subtitle E of title VIII, add the following:
SEC. 885. PROHIBITION ON ACQUISITION OF CERTAIN SILICON
CARBIDE-BASED SEMICONDUCTORS MANUFACTURED IN
CHINA.
(a) Restrictions on Silicon Carbide Wafer Sourcing.—The
Secretary of Defense shall revise section 252.225 of the
Department of Defense Supplement to the Federal Acquisition
Regulation to prohibit the procurement of semiconductors,
other than commercially available off-the-shelf items (as
defined in section 104 of title 41, United States Code), that
are manufactured on silicon carbide wafers that are
manufactured in the Peoples Republic of China. Such revision
may provide the authority for the Secretary to issue a waiver
on a case-by-case basis.
(b) Briefing on Financial Instruments.—Not later than 180
days after the date of the enactment of this Act, the
Secretary of Defense and the Deputy Secretary of Defense
shall conduct a review, and provide to the congressional
defense committees a briefing on the results of such a
review, of domestic manufacturers of silicon carbide wafers
that are critical to the Department of Defense and that are
facing challenges due to Chinese exports of such wafers.
(c) Briefing on Establishment of Common Foundries.—Not
later than 180 days after the date of the enactment of this
section, the Secretary of Defense provide to the
congressional defense committees a briefing that evaluates
the merits of encouraging major prime contractors in the
defense industrial base to consolidate silicon carbide
semiconductor design and fabrication operations in common
commercial foundries to encourage economies of scale and
quality improvements.
(d) Consultation With the Chips Program Office.—The
Secretary shall provide information to the Secretary of
Commerce and other appropriate Federal agency heads on the
use of Research and Development amounts to develop silicon
carbide-related manufacturing technology for manufacturing
high-purity single crystal silicon carbide boules, ingots,
and wafers at 300mm scale for purposes of—
(1) developing next-generation high-voltage technology; and
(2) advancing state-of-the-art packaging power modules.
(e) Policy on Interagency Deliberations.—Not later than 90
days after the date of the enactment of this section, the
Secretary of Defense shall issue a policy for recommendations
for interagency consideration in deliberations on encouraging
allied and partner countries to ensure the silicon carbide
substrate supply chains of such countries for national
security systems and critical infrastructure do not include
Chinese-manufactured silicon carbide wafers.