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Congressional Daily Record
This section is about changes proposed to a bill or resolution. It mentions members such as Catherine Marie Cortez Masto.
Issued
June 24, 2026
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Download official Senate Record PDFReturn to issue contextSA 6390. Ms. CORTEZ MASTO submitted an amendment intended to be proposed by her to the bill S. 4784, to authorize appropriations for fiscal year 2027 for military activities of the Department of Defense, for military construction, and for defense activities of the Department of Energy, to prescribe military personnel strengths for such fiscal year, and for other purposes; which was ordered to lie on the table; as follows:
In section 1248, strike subsection (c) and insert the
following
(a) Covered AI Chip Defined.—In this section, the term
“covered AI chip” means any advanced integrated circuit,
computer, or other product that—
(1)(A) is designed by or manufactured using technology
originating in the United States, including items produced
abroad using intellectual property, design software, or
semiconductor manufacturing equipment originating in the
United States; and
(B)(i) is classified or classifiable under Export Control
Classification Number 3A090, 4A090, 5A002.z, related .z
Export Control Classification Numbers, or any successor
classification; or
(ii) is an item that is functionally equivalent to an item
classified or classifiable as described in clause (i);
(2) an integrated circuit, computer, or other product that
is—
(A) classified under Export Control Classification Number
3A090 or 4A090 or related Export Control Classification
Numbers; or
(B) functionally equivalent or substantially similar to a
circuit, computer, or product described in subparagraph (A);
or
(3) an integrated circuit that has one or more digital
processing units with—
(A) a total processing performance of 4,800 or more;
(B) a total processing performance of 2,400 or more and a
performance density of 1.6 or more;
(C) a total processing performance of 1,600 or more and a
performance density of 3.2 or more; or
(D) a total DRAM bandwidth of 1,400 gigabytes per second or
more, interconnect bandwidth of 1,100 gigabytes per second or
more, or a sum of DRAM bandwidth and interconnect bandwidth
of 1,700 gigabytes per second or more.