MATCH Act

Summary

Requires U.S. agencies to identify U.S.-origin semiconductor manufacturing equipment and foreign facilities of concern, press allies to adopt matching countrywide export controls and license-deny policies, and—if diplomacy fails—issue U.S. regulations to extend countrywide controls and comprehensive restrictions to covered equipment and facilities. Sets firm deadlines for agency reviews, briefings to Congress, certifications about allied adoption, and publication of regulations (including a 150-day deadline to act), with annual updates thereafter.

• Directs U.S. agencies to identify covered semiconductor manufacturing equipment and covered facilities and report lists to Congress within 60 days and annually.
• Requires agencies to brief Congress within 90 days on diplomatic efforts, incentives, and which allied suppliers have not adopted controls.
• Mandates publication of U.S. regulations within 150 days to ensure U.S. countrywide controls cover U.S.-origin covered equipment and to restrict covered facilities in countries of concern.
• Pushes for allied coordination: calls for allied adoption of countrywide controls and license-deny policies covering all relevant equipment and related items.
• If diplomacy fails, agencies must extend U.S. jurisdiction or impose licensing and end-use restrictions on exports from non‑complying allied supplier countries.
• Establishes an annual review and update cycle for lists, certifications, briefings, and regulations.
• Targets advanced-node semiconductor production, related components, and software tied to advanced computing and AI capabilities.
• Creates potential extraterritorial effects by asserting controls over exports linked to allied supplier countries that fail to implement matching rules.